| 摘要 |
PROBLEM TO BE SOLVED: To improve packaging reliability of a semiconductor device.SOLUTION: In a semiconductor device manufacturing method: a plurality of leads LD are cut in a state of being sandwiched by an upper mold LCM2 and a lower mold LCM1; a clearance is formed between a post (guide rail) and a bush (rail holding part), which control a slide operation by the upper mold LCM2; and a positional relationship between the lower mold LCM1 which supports the plurality of leads LD and an upper mold LCM2 which contacts lower surfaces LDb of the plurality of leads LD is adjusted after the plurality of leads LD are sandwiched by the upper mold LCM2 and the lower mold LCM1 and before being cut.SELECTED DRAWING: Figure 18 |
