| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board which can reduce ion migration of neighboring conductor patterns 32, 32... formed between conductor pads 31, 31.SOLUTION: A printed wiring board 1A comprises a second insulation layer 26 made of an insulating material and a third conductor layer 35 formed on the second insulation layer 26. The third conductor layer 35 includes a plurality of conductor pads 31, 31,... electrically connected to an electronic component 5 and a plurality of conductor patterns 32, 32, ... formed between the conductor pads 31, 31. A pattern width L of the conductor pattern 32 is equal to or less than 3 μm and a pattern interval S between the neighboring conductor patterns 32, 32 is equal to or less than 3 μm. On each surface of the insulation layer 26 between the conductor patterns 32, 32, a recess 36 sunken from a contact interface 39 where the conductor pattern 32 contacts the second insulation layer 26 is formed at each position at least along the conductor patterns. A depth of the recess 36 is within a range of 0.1-2.0 μm.SELECTED DRAWING: Figure 4 |
