| 摘要 |
PROBLEM TO BE SOLVED: To provide a package substrate unlikely to be warped, and increasing the signal transmission speed between electronic components, and to provide a method of manufacturing a package substrate.SOLUTION: A wiring layer 158Fa dedicated to data transmission between electronic components is provided between the outermost interlayer resin insulation layer 150Fb and an inner layer interlayer resin insulation layer 150Fa, thus increasing the signal transmission speed between electronic components. Since a stack via conductor 160FT is provided on the outer peripheral side of a second conductor circuit dedicated to data transmission on the center side of a package substrate, conductors in the wiring layer 158Fa are not distributed unevenly, and the package substrate is less likely to be warped.SELECTED DRAWING: Figure 1 |
