| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate dividing method using a laser of a low output, which is of non-contact, excellent productivity, and compact in construction, and a substrate dividing apparatus.SOLUTION: A substrate dividing method for dividing a substrate along a cutting-scheduled line, comprises: the line drawing step of forming a line-shaped film along said cutting-scheduled line on the surface of said substrate; the heating step of heating said substrate surface through said film by irradiating said film with a laser beam; and the cutting step of cutting said substrate along said cutting-scheduled line by the deformation of said substrate due to said heating step.SELECTED DRAWING: Figure 3 |
