| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable epoxy resin composition which can form a cured material having high heat resistance, moisture resistance, and thermal shock resistance, and can form a cured material which improves electric conduction characteristics under a high temperature condition and under a high temperature and high humidity condition, thermal shock resistance, and moisture absorption reflow resistance of an optical semiconductor device.SOLUTION: The curable epoxy resin composition comprises an alicyclic epoxy compound (A), core-shell type acrylic polymer particles (B) having an SP value of 19.5 to 21.5 [MPa], a curing agent (C), and a curing accelerator (D). A content of the core-shell type acrylic polymer particles (B) is 1 to 30 pts.wt relative to 100 pts.wt of the alicyclic epoxy compound (A). The epoxy resin composition contains as the curing agent (C) at least one selected from norbornane dicarboxylic anhydride and hexahydrophthalic anhydride. When norbornane dicarboxylic anhydride is contained as the curing agent (C), a content of succinic acid relative to a total amount of the curing agent (C) is 0.4 wt% or less.SELECTED DRAWING: None |
