发明名称 CONDUCTIVE JOINING BODY
摘要 PROBLEM TO BE SOLVED: To provide a conductive joining body including a function for mitigating or being resistant to impulse or stress that the joining body receives, correspondently to microfabrication of the conductive joining body or deformation of a junction.SOLUTION: A conductive joint material forming the conductive joining body maintains a liquid state in an usage area and the conductive joint material leaks from the junction or a protective material is used for improving a joining strength, thereby mitigating a load such as impulse that receives the conductive joining body receives or a load such as a stress that is generated in the conductive joining body. In addition, even in the case where the junction is deformed, a junction interface can be stably maintained by both joined parts forming the conductive joining body and the conductive joint material.SELECTED DRAWING: None
申请公布号 JP2016051810(A) 申请公布日期 2016.04.11
申请号 JP20140176249 申请日期 2014.08.29
申请人 NIHON SUPERIOR CO LTD 发明人 NISHIMURA TETSUO
分类号 H05K3/34;H05K3/32 主分类号 H05K3/34
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