PLANAR INDUCTIVE ELEMENT AND METHOD OF HEAT REMOVAL FROM ITS WINDINGS

摘要

FIELD: electricity.SUBSTANCE: heat removal from the windings of a planar inductive element (PIE) located in a multilayer printed circuit-board (MPCB) is ensured by the formation of the MPCB surface of contact areas; the contact areas connection with winding ends; installation on the contact areas of the different windings of the current conducting heat removal element, wherein the heat transfer from the windings is ensured by the assurance of the thermal contact of the surface of the current conducting heat removal element with a heat dissipating element.EFFECT: assurance of effective heat removal from the windings of the planar inductive element, located in the MPCB due to decreasing of the heat path length, and thermal resistance between the windings and environment.3 cl, 3 dwg