发明名称 MICROSTRUCTURE-BASED WOUND CLOSURE DEVICES
摘要 The present invention relates generally to wound closure devices comprising one or more microstructures. The devices are designed such that the microstructures are able to grip the skin or tissue surrounding a wound, optionally closing the wound, or securing the tissue or skin in place. Also provided are wound closure systems that comprise one or more microstructure wound closure devices along with other components, such as protective covers and wound healing therapeutics. A variety of packaging specifications are disclosed, as is a dispenser apparatus configured to enable simple one-handed application of the wound closure devices. Methods described herein provide for the closure of various wounds with the wound closure devices and systems.
申请公布号 HK1209614(A1) 申请公布日期 2016.04.08
申请号 HK20150110283 申请日期 2015.10.20
申请人 UNIVERSITY OF WASHINGTON THROUGH ITS CENTER FOR CO 发明人 ROLANDI, MARCO;RUVOLO, VITTORIO;BERENSON, RONALD, J.;RUEBEL, CHASE;JIN, JUNGHO
分类号 A61F;A61B;A61M;B29C;B81C 主分类号 A61F
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