发明名称 |
METHOD AND APPARATUS FOR TREATING SUBSTRATE |
摘要 |
The present invention relates to a substrate treating method for improving process efficiency. According to an embodiment of the present invention, in the substrate treating method for fixing a substrate to an electrostatic chuck by an electrostatic force in a process chamber, and treating a substrate by using plasma from a process gas, fixing the substrate by the electrostatic chuck may be carried out after the process gas is supplied. |
申请公布号 |
KR20160039042(A) |
申请公布日期 |
2016.04.08 |
申请号 |
KR20140131775 |
申请日期 |
2014.09.30 |
申请人 |
SEMES CO., LTD. |
发明人 |
LIM, DOO HO;KIM, YOUNG BEAN;LEE, IN TAEK;HAM, YONG HYUN |
分类号 |
H01L21/3065;H01L21/02;H05H1/46 |
主分类号 |
H01L21/3065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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