| 摘要 |
PROBLEM TO BE SOLVED: To provide a coverlay in which an adhesion layer is improved in heat resistance, a flexible printed wiring board and an LED module.SOLUTION: The coverlay includes a cover film that has insulation properties and flexibility, and the adhesion layer that is laminated on one surface of the cover film. The coverlay is laminated at least on one surface side of the flexible printed wiring board including an LED mounting land part. The cover film has light reflectivity, and the adhesion layer contains siloxane modified polyimide, an epoxy resin and an inorganic filler. A weight average molecular weight (Mw) of the siloxane modified polyimide is 25,000 or more and 150,000 or less. Preferably, the cover film includes a substrate layer and a reflection layer that is laminated on another surface side of the substrate layer. Preferably, the reflection layer contains a white pigment and a binder of the white pigment.SELECTED DRAWING: Figure 1 |
