发明名称 BREAKING DEVICE AND DIVIDING METHOD OF BRITTLE MATERIAL SUBSTRATE IN BREAKING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a breaking device which does not cause contacting between a pushing blade and a frame body.SOLUTION: A breaking device which divides a brittle material substrate by extension of a crack from a scribe line formed on the one side principal plane side of the substrate beforehand includes: an elastomer in which a substrate holding member made by stretching an adhesive film on a circular-ring shaped frame body and attaching one side principal plane side of the brittle material substrate to the adhesive film is mounted on an upper surface of the elastomer; a pushing blade disposed so as to permit contact with the other side principal plane side of the brittle material substrate in such a state that the substrate holding member is mounted on the elastomer; and a frame body pushing-down mechanism which is disposed so as to freely permit elevation in the vertical direction, is brought into contact with the frame body upon falling and pushes down the frame body. Therein, the pushing blade is brought into contact with a position corresponding to a formation position of the scribe line of the other side principal plane side and, thereby, while the brittle material substrate is divided, it is set that the frame body pushing-down mechanism pushes down the frame body to the lower side than one side principal plane of the brittle material substrate.SELECTED DRAWING: Figure 3
申请公布号 JP2016047628(A) 申请公布日期 2016.04.07
申请号 JP20140173545 申请日期 2014.08.28
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO LTD 发明人 ISOKAWA HISAJI;MIYAKI ICHIRO;KURIYAMA NORIYOSHI;HASHIMOTO TAICHI;TAKEDA MASAKAZU;MURAKAMI KENJI
分类号 B28D5/00;H01L21/301 主分类号 B28D5/00
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