SUBSTRATE PROCESSING DEVICE

摘要

A substrate processing device according to an embodiment of the present invention comprises: a removal part (D1) that removes liquid droplets which exist in a recess (30); a liquid discharge hole (30a) that is provided in a bottom part of the recess (30) of a nozzle head (32), and that discharges liquid droplets to be removed to the outside of the recess (30); and a control part (8) that controls an ejection state of a gas ejection nozzle (33) so that a period, in which a gas is ejected from the gas ejection nozzle (33) in a flow amount such that the gas does not reach a surface to be treated of a substrate W, exists during a period from completion of a rinse treatment by a treatment liquid on the surface to be treated until initiation of a drying treatment using a gas.