POWER MODULE PACKAGE

摘要

A power module package with reliable electric connection according to a preferable embodiment of the present invention comprises a heat radiation substrate which has at least one penetration hole and a circuit pattern, and is mounted with a semiconductor chip to be electrically connected to the circuit pattern; a case which has a terminal electrically connected to the circuit pattern; a coupling member which couples the heat radiation substrate with the case by making the penetration hole of the heat radiation substrate face the lower surface of the case; and a molding part which fills a gap between the heat radiation substrate and the case.