CIRCUIT BOARD AND MANUFACTURING MEHTOD THEREOF

摘要

Disclosed is a circuit board, which comprises: a first metal layer having a first via hole penetrating through an upper surface of the first metal layer and a lower surface thereof; a plated part provided to a surface of the first via hole; an insulating film provided to a surface of the plated part; and a first via formed by providing a conductive material to at least a portion of a region surrounded by an outer surface of the insulating film. As the circuit board may minimize the first via, while forming the first metal layer to be thicker than the existing layer, warpage may be reduced and heat dissipation performance may be improved.