| 摘要 |
The present invention relates to a photosensitive resin composition for a dry film photoresist. More specifically, provided is a photosensitive resin composition for a dry film photoresist which can ease the workability by improving adhesiveness ot the photosensitive resin composition to a substrate and can achieve appropriate physical properties (resolution and fine wire adhesiveness) even with a small exposure amount. In addition, the photosensitive resin composition of the present invention is suitable for a laser direct exposure device, thereby maximizing productivity in the production of images for companies where the speed of an exposure process depends to an entire production speeds, printed circuit board (PCB), a lead frame, a plasma display panel (PDP), and other display devices. |
