| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing pad capable of removing waviness of a surface of an object to be polished having a curved surface.SOLUTION: A polishing pad 10 has a polished surface 30 formed of a hard resin layer 40, and has structures 40 and 50 for making the polished surface 30 follow a curved surface of an object to be polished. The structure of making the polished surface of the polishing pad follow the curved surface of the object to be polished may be, for instance, a two-layer structure of a hard resin layer forming the polished surface and a soft resin layer supporting the hard resin layer. When the polished surface is pressed against the curved surface of the object to be polished, the soft resin layer is distorted according to the curved surface, and thereby the hard resin layer is bent, and the polished surface follows the curved surface of the object to be polished.SELECTED DRAWING: Figure 1 |
