| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper alloy for electronic and electrical device, a component and a terminal for electronic and electrical device excellent in flexure processability and stress relaxation resistance, high in strength and capable of thinning component raw material than conventional.SOLUTION: A copper alloy has a composition containing, Ni of 1.0 mass% to 5.0 mass%, Si of 0.1 mass% to 1.5 mass% and the balance Cu with inevitable impurities and having Ni/Si (mass ratio) of 2.0 to 6.0 and satisfies following formulae, where Lis a length of small tilt angle grain boundary and subgrain boundary, Lis a length of large tilt angle grain boundary between measurement points having orientation difference of neighboring measurement points of over 15° and Lσ is length of Σ3, Σ9, Σ27a, Σ27b grain boundary. Lσ/(L+L)>10%, L/(L+L)>10%, (L+Lσ)/(L+L)>40%.SELECTED DRAWING: None |
