| 发明名称 |
Temperature compensated compound resonator |
| 摘要 |
The invention concerns microelectromechanical resonators. In particular, the invention provides a resonator comprising a support structure, a doped semiconductor resonator suspended to the support structure by at least one anchor, and actuator for exciting resonance into the resonator. According to the invention, the resonator comprises a base portion and at least one protrusion extending outward from the base portion and is excitable by said actuator into a compound resonance mode having temperature coefficient of frequency (TCF) characteristics, which are contributed by both the base portion and the at least one protrusion. The invention enables simple resonators, which are very well temperature compensated over a wide temperature range. |
| 申请公布号 |
US2016099702(A1) |
申请公布日期 |
2016.04.07 |
| 申请号 |
US201514874514 |
申请日期 |
2015.10.05 |
| 申请人 |
Teknologian tutkimuskeskus VTT Oy |
发明人 |
Jaakkola Antti;Pekko Panu;Prunnila Mika;Pensala Tuomas |
| 分类号 |
H03H9/02;H03H9/05;H03H9/24 |
主分类号 |
H03H9/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A microelectromechanical resonator device comprising;
a support structure, an actuator, a doped semiconductor resonator, wherein the resonator has a base portion and at least one protrusion extending from the base portion, and wherein the resonator is excitable by said actuator into a compound resonance mode having temperature coefficient of frequency (TCF) characteristics which are contributed by both the base portion and the at least one protrusion, and at least one anchor suspending the resonator to the support structure. |
| 地址 |
Espoo FI |
