| 发明名称 |
SEMICONDUCTOR DEVICE |
| 摘要 |
A semiconductor device includes: a semiconductor substrate having a main plane; a semiconductor element provided on the main plane of the semiconductor substrate; an electrode pad provided on the main plane of the semiconductor substrate and connected to the semiconductor element; a guard ring surrounding the semiconductor element and the electrode pad, and provided on the main plane of the semiconductor substrate; and an insulating film covering all region of a semiconductor of the main plane of the semiconductor substrate exposed inside the guard ring, wherein the insulating film is made of a water impermeable material. |
| 申请公布号 |
US2016099193(A1) |
申请公布日期 |
2016.04.07 |
| 申请号 |
US201514796674 |
申请日期 |
2015.07.10 |
| 申请人 |
Mitsubishi Electric Corporation |
发明人 |
NOGAMI Yoichi |
| 分类号 |
H01L23/31;H01L23/00;H01L23/58 |
主分类号 |
H01L23/31 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device comprising:
a semiconductor substrate having a main plane; a semiconductor element provided on the main plane of the semiconductor substrate; an electrode pad provided on the main plane of the semiconductor substrate and connected to the semiconductor element; a guard ring surrounding the semiconductor element and the electrode pad, and provided on the main plane of the semiconductor substrate; and an insulating film covering the semiconductor element and a portion of the semiconductor substrate comprising the semiconductor substrate inside the guard ring and directly contacting to, wherein the insulating film is made of a water impermeable material and is brought into direct contact with the guard ring and the main plane of the semiconductor substrate in a region where the semiconductor element is not provided. |
| 地址 |
Tokyo JP |
