| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and an inspection method of the same, which can identify a broken semiconductor chip in an unsealed state without unsealing the semiconductor device.SOLUTION: In a semiconductor device, each of a plurality of IGBT chips 2 includes a failure identification pattern 5 formed by a plurality of dots is formed on a surface of each IGBT chip 2. Also on each of a plurality of diode chips, a failure identification pattern is formed. Each dot of the failure identification pattern 5 is formed by a sintering silver paste 5a obtained by applying a small amount of a silver paste so as to contact a surface of a surface electrode formed on a semiconductor substrate and sintering the silver paste 5a.SELECTED DRAWING: Figure 2 |
