| 发明名称 |
THERMAL STABILIZATION OF TEMPERATURE SENSITIVE COMPONENTS |
| 摘要 |
An enclosure for thermally stabilizing a temperature sensitive component on a circuit board is provided. The enclosure comprises a first cover section configured to be mounted over a portion of a first side of the circuit board where at least one temperature sensitive component is mounted. The first cover section includes a first lid, and at least one sidewall that extends from a perimeter of the first lid. The enclosure also comprises a second cover section configured to be mounted over a portion of a second side of the circuit board opposite from the first cover section. The second cover section includes a second lid, and at least one sidewall that extends from a perimeter of the second lid. The first and second cover sections are configured to releasably connect with the circuit board. |
| 申请公布号 |
US2016100494(A1) |
申请公布日期 |
2016.04.07 |
| 申请号 |
US201414504948 |
申请日期 |
2014.10.02 |
| 申请人 |
Honeywell International Inc. |
发明人 |
Novysedlak Peter;Hajek Ondrej;Konecny Martin;Vasicek Milan |
| 分类号 |
H05K5/02;H05K5/00;H05K1/02 |
主分类号 |
H05K5/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An enclosure for thermally stabilizing a temperature sensitive component on a circuit board, the enclosure comprising:
a first cover section configured to be mounted over a portion of a first side of the circuit board where at least one temperature sensitive component is mounted, the first cover section including a first lid and at least one sidewall that extends from a perimeter of the first lid; and a second cover section configured to be mounted over a portion of a second side of the circuit board opposite from the first cover section, the second cover section including a second lid and at least one sidewall that extends from a perimeter of the second lid; wherein the first and second cover sections are configured to releasably connect with the circuit board. |
| 地址 |
Morristown NJ US |
