发明名称 ANISOTROPIC CONDUCTIVE FILM, METHOD OF MANUFACTURING THE SAME, AND PRINTED CIRCUIT BOARD USING THE SAME
摘要 There are provided an anisotropic conductive film, a method of manufacturing the same, and a printed circuit board using the same. More specifically, the anisotropic conductive film according to an exemplary embodiment of the present disclosure includes an insulating mattress containing a non-conductive polymer, and a plurality of conductive cylinders formed in a direction from an upper surface to a lower surface of the insulating mattress, containing a conductive polymer. Further, the printed circuit board using the anisotropic conductive film of the present disclosure may prevent open or short between upper circuit patterns and lower circuit patterns, and allow a fine pitch between the circuit patterns, due to the structure of the anisotropic conductive film formed between the substrates.
申请公布号 US2016100481(A1) 申请公布日期 2016.04.07
申请号 US201514755947 申请日期 2015.06.30
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 KIM Young Soon
分类号 H05K1/03;H01B1/20;H05K1/02;B29C39/00 主分类号 H05K1/03
代理机构 代理人
主权项 1. An anisotropic conductive film comprising: an insulating mattress containing a non-conductive polymer; and a plurality of conductive cylinders formed in a direction from an upper surface to a lower surface of the insulating mattress, containing a conductive polymer.
地址 Suwon-Si KR