发明名称 |
CURABLE SILICONE EMULSION COMPOSITION |
摘要 |
Provided is a curable silicone emulsion composition which has comparable curability without using an organotin compound curing catalyst, and for which the post-curing film properties thereof can obtain a comparable hardness, tensile strength, and elongation. A curable silicone emulsion composition characterized by including: (A) 100 parts by mass of an organopolysiloxane which includes a hydroxyl group bonded to at least two silicon atoms per molecule; (B) 0.01-5 parts by mass of an organohydrogenpolysiloxane which includes at least two silicon atom-bonded hydrogen atoms per molecule; (C) 1-10 parts by mass of the reaction product of an amino group-containing organoalkoxysilane and an acid anhydride; (D) 0.1-10 parts by mass of an epoxy group-containing organoalkoxysilane and/or a partial hydrolysis condensation product thereof; (E) 0.5-50 parts by mass of a colloidal silica; (F) 0.1-10 parts by mass of a bismuth compound; and (G) 50-500 parts by mass of water. |
申请公布号 |
US2016096959(A1) |
申请公布日期 |
2016.04.07 |
申请号 |
US201414891021 |
申请日期 |
2014.03.26 |
申请人 |
SHIN-ETSU CHEMICAL CO., LTD |
发明人 |
HIRAI Motohiko |
分类号 |
C08L83/08 |
主分类号 |
C08L83/08 |
代理机构 |
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代理人 |
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主权项 |
1. A curable silicone emulsion composition comprising
(A) 100 parts by weight of an organopolysiloxane containing at least two silicon-bonded hydroxyl groups per molecule, (B) 0.01 to 5 parts by weight of an organohydrogenpolysiloxane containing at least two silicon-bonded hydrogen atoms per molecule, (C) 1 to 10 parts by weight of a reaction product of an amino-containing organoalkoxysilane with an acid anhydride, (D) 0.1 to 10 parts by weight of an epoxy-containing organoalkoxysilane and/or partial hydrolytic condensate thereof, (E) 0.5 to 50 parts by weight of colloidal silica, (F) 0.1 to 10 parts by weight of a bismuth compound, and (G) 50 to 500 parts by weight of water. |
地址 |
Tokyo JP |