发明名称 CURABLE SILICONE EMULSION COMPOSITION
摘要 Provided is a curable silicone emulsion composition which has comparable curability without using an organotin compound curing catalyst, and for which the post-curing film properties thereof can obtain a comparable hardness, tensile strength, and elongation. A curable silicone emulsion composition characterized by including: (A) 100 parts by mass of an organopolysiloxane which includes a hydroxyl group bonded to at least two silicon atoms per molecule; (B) 0.01-5 parts by mass of an organohydrogenpolysiloxane which includes at least two silicon atom-bonded hydrogen atoms per molecule; (C) 1-10 parts by mass of the reaction product of an amino group-containing organoalkoxysilane and an acid anhydride; (D) 0.1-10 parts by mass of an epoxy group-containing organoalkoxysilane and/or a partial hydrolysis condensation product thereof; (E) 0.5-50 parts by mass of a colloidal silica; (F) 0.1-10 parts by mass of a bismuth compound; and (G) 50-500 parts by mass of water.
申请公布号 US2016096959(A1) 申请公布日期 2016.04.07
申请号 US201414891021 申请日期 2014.03.26
申请人 SHIN-ETSU CHEMICAL CO., LTD 发明人 HIRAI Motohiko
分类号 C08L83/08 主分类号 C08L83/08
代理机构 代理人
主权项 1. A curable silicone emulsion composition comprising (A) 100 parts by weight of an organopolysiloxane containing at least two silicon-bonded hydroxyl groups per molecule, (B) 0.01 to 5 parts by weight of an organohydrogenpolysiloxane containing at least two silicon-bonded hydrogen atoms per molecule, (C) 1 to 10 parts by weight of a reaction product of an amino-containing organoalkoxysilane with an acid anhydride, (D) 0.1 to 10 parts by weight of an epoxy-containing organoalkoxysilane and/or partial hydrolytic condensate thereof, (E) 0.5 to 50 parts by weight of colloidal silica, (F) 0.1 to 10 parts by weight of a bismuth compound, and (G) 50 to 500 parts by weight of water.
地址 Tokyo JP