| 摘要 |
Polishing pad for use with high-speed mechanical buffers or for use by hand. More specifically, a polishing pad and methods of use for the polishing pad, the polishing pad having a foam pad, and having a cloth, a foam, or both attached to a top surface of the foam pad, with the cloth, the foam, or both covering part of the top surface of the foam pad such that gaps in the coverage allow for the foam pad and either the cloth, the foam, or both to touch a polishing surface at the same time. |
