发明名称 A HANGER FOR USE IN ELECTROPLANTING OF PCB
摘要 According to a desirable embodiment of the present invention, a hanger for plating a substrate comprises: a fixing frame equipped with an upper frame having at least one vertical supporting rod, a lower frame having a plurality of lower clamps, a right frame, and a left frame; an operation bar equipped with the upper clamp, and coupled to be glided in a vertical direction from the upper frame of the fixing frame; a spring member interposed between the operation bar and the upper frame of the fixing frame to limit a displacement of the operation bar; and a power feeding unit connected to electrically be communicated with at least one vertical supporting rod. The purpose of the present invention is to prevent bending of the substrate by providing a tension for the substrate which is a target object to be plated.
申请公布号 KR20160038553(A) 申请公布日期 2016.04.07
申请号 KR20140131776 申请日期 2014.09.30
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 CHA, IL HO
分类号 C25D17/06;C25D17/08 主分类号 C25D17/06
代理机构 代理人
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