| 摘要 |
The present invention relates to solder paste which comprises: solder powder; plating metal formed to have a thickness of 0.1 to 100 μm on the whole surface of the solder powder, and having a lower melting temperature than the solder powder; and flux or epoxy. According to the present invention, provided is the solder paste which restricts heating slump occurrence when soldering is performed, and prevents a PCB substrate from being bent. |
