发明名称 MULTILAYER THERMAL SHIELD COMPRISING AN INTEGRATED FLUID CIRCUIT
摘要 When products to be shipped are temperature-sensitive, it is necessary to maintain a substantially uniform and constant temperature to avoid spoilage. As a result, thermal shields are often placed on top of the products. Many designs for thermal shields have been considered in the past but improvements are still desired. Accordingly, there is provided a multilayer thermal shield (100) comprising a thermally conductive layer (108), and at least one heat exchange fluid circuit (120) coupled to a first surface of the thermally conductive layer, the at least one heat exchange fluid circuit comprising at least one inlet (124) configured to permit the ingress of heat exchange fluid. The thermal shield further comprises an outer insulation layer (104) connected to a first surface of the thermally conductive layer (108) and comprising grooves designed to receive the heat exchange fluid circuit. The thermal shield further comprises an inner insulation layer (110) connected to a second surface of the thermally conductive layer (108).
申请公布号 WO2016049773(A1) 申请公布日期 2016.04.07
申请号 WO2015CA50993 申请日期 2015.10.02
申请人 SUNWELL ENGINEERING COMPANY LIMITED 发明人 GOLDSTEIN, VLADIMIR;CORY, ROSA;DO, BENNY
分类号 F28D1/047;B65D81/38;F16L59/00;F25D17/02 主分类号 F28D1/047
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