发明名称 |
PACKAGING MATERIAL FOR MOLDING |
摘要 |
A packaging material (1) for molded articles comprises: an outer base layer (13) made of a thermo-resistant resin; an inner sealant layer (15) made of a thermoplastic resin; a metal thin layer (11) interposed between the outer base layer (13) and the inner sealant layer (15); and a protective coat layer (14) formed on a side of the outer base layer (13) opposite to the side of the outer base layer (13) of the metal thin layer (11). The protective coat layer (14) is made of a resin composite composed of a main resin containing a phenoxy resin, a urethane resin, and a hardening agent. The thickness of the protective coat layer (14) is 0.1-10 μm. The purpose of the present invention is to provide the packaging material for molded articles with chemical resistance, solvent resistance, and scratch resistance. |
申请公布号 |
KR20160038763(A) |
申请公布日期 |
2016.04.07 |
申请号 |
KR20150133652 |
申请日期 |
2015.09.22 |
申请人 |
SHOWA DENKO PACKAGING CO., LTD. |
发明人 |
WANG HONGLIN;MINAMIBORI YUUJI |
分类号 |
B32B15/088;B32B15/095;B65D65/40;H01M2/02 |
主分类号 |
B32B15/088 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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