发明名称 ORGANIC THERMAL CONDUCTIVE ADDITIVE, AND METHOD FOR ADDING THERMAL CONDUCTIVITY TO PLASTIC USING RESIN COMPOSITION AND CURED ARTICLE
摘要 PROBLEM TO BE SOLVED: To add thermal conductivity to plastic.SOLUTION: The present invention relates to adding of an organic thermal conductive additive containing a liquid crystalline thermoplastic resin which is mainly composed of a chain structure, where the main chain mainly contains repeating units consisting of a unit represented by the following general formula (2), the resin itself having a thermal conductivity of 0.45 W/(m K) or more. -A-x-A-y-R-z- (2), where Aand Arepresent each independently a substituent selected from an aromatic group, a condensed aromatic group, an alicyclic group, and an alicyclic heterocyclic group, x represents each independently a bivalent substituent selected from a group of -CO-O- or -N(O)=N-, -y-R-z- represents -O-CO-R-CO-O-, R represents a hydrocarbon group having even numbered carbon atoms out of a liner aliphatic hydrocarbon group having 8 to 20 carbon atoms.SELECTED DRAWING: None
申请公布号 JP2016047934(A) 申请公布日期 2016.04.07
申请号 JP20150244558 申请日期 2015.12.15
申请人 KANEKA CORP 发明人 YOSHIHARA SHUSUKE;MATSUMOTO KAZUAKI
分类号 C08L101/00;C08K3/00;C08L101/12;C09K5/14 主分类号 C08L101/00
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