发明名称 |
POWER CONVERSION APPARATUS |
摘要 |
A power conversion apparatus includes a semiconductor module that includes a main body containing at least one semiconductor element, power terminals projecting from the main body to be connected to a high-voltage DC power supply and high-voltage signal terminals projecting from the main body, and is configured to convert a DC power supplied from the high-voltage DC power supply to an AC power by switching operation of the semiconductor element. The power conversion apparatus further includes a low-voltage component connected to a low-voltage DC power supply and a control circuit board on which a control circuit for controlling the switching operation of the semiconductor element is formed. The control circuit board is connected with low-voltage signal terminals extending from the low-voltage component and the high-voltage signal terminals. The low-voltage and high-voltage signal terminals are solder-connected to the control circuit board. |
申请公布号 |
US2016099655(A1) |
申请公布日期 |
2016.04.07 |
申请号 |
US201514874914 |
申请日期 |
2015.10.05 |
申请人 |
DENSO CORPORATION |
发明人 |
INAMURA Hiroshi;TACHIBANA Hideaki |
分类号 |
H02M7/00;H02M7/537 |
主分类号 |
H02M7/00 |
代理机构 |
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代理人 |
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主权项 |
1. A power conversion apparatus comprising:
a semiconductor module that includes a main body containing at least one semiconductor element, power terminals projecting from the main body to be connected to a high-voltage DC power supply and high-voltage signal terminals projecting from the main body, and is configured to convert a DC power supplied from the high-voltage DC power supply to an AC power by switching operation of the semiconductor element; a low-voltage component connected to a low-voltage DC power supply whose output voltage is lower than an output voltage of the high-voltage DC power supply; and a control circuit board on which a control circuit for controlling the switching operation of the semiconductor element is formed, wherein the control circuit board is connected with low-voltage signal terminals extending from the low-voltage component and the high-voltage signal terminals, and the low-voltage signal terminals and the high-voltage signal terminals are solder-connected to the control circuit board. |
地址 |
Kariya-city JP |