发明名称 POWER CONVERSION APPARATUS
摘要 A power conversion apparatus includes a semiconductor module that includes a main body containing at least one semiconductor element, power terminals projecting from the main body to be connected to a high-voltage DC power supply and high-voltage signal terminals projecting from the main body, and is configured to convert a DC power supplied from the high-voltage DC power supply to an AC power by switching operation of the semiconductor element. The power conversion apparatus further includes a low-voltage component connected to a low-voltage DC power supply and a control circuit board on which a control circuit for controlling the switching operation of the semiconductor element is formed. The control circuit board is connected with low-voltage signal terminals extending from the low-voltage component and the high-voltage signal terminals. The low-voltage and high-voltage signal terminals are solder-connected to the control circuit board.
申请公布号 US2016099655(A1) 申请公布日期 2016.04.07
申请号 US201514874914 申请日期 2015.10.05
申请人 DENSO CORPORATION 发明人 INAMURA Hiroshi;TACHIBANA Hideaki
分类号 H02M7/00;H02M7/537 主分类号 H02M7/00
代理机构 代理人
主权项 1. A power conversion apparatus comprising: a semiconductor module that includes a main body containing at least one semiconductor element, power terminals projecting from the main body to be connected to a high-voltage DC power supply and high-voltage signal terminals projecting from the main body, and is configured to convert a DC power supplied from the high-voltage DC power supply to an AC power by switching operation of the semiconductor element; a low-voltage component connected to a low-voltage DC power supply whose output voltage is lower than an output voltage of the high-voltage DC power supply; and a control circuit board on which a control circuit for controlling the switching operation of the semiconductor element is formed, wherein the control circuit board is connected with low-voltage signal terminals extending from the low-voltage component and the high-voltage signal terminals, and the low-voltage signal terminals and the high-voltage signal terminals are solder-connected to the control circuit board.
地址 Kariya-city JP