| 发明名称 |
POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, CURED PRODUCT, INTERLAYER INSULATING FILM, COVER COAT LAYER, SURFACE PROTECTIVE FILM AND ELECTRONIC COMPONENT |
| 摘要 |
A positive photosensitive resin composition which contains (a) an alkali-soluble resin, (b) an onium salt which generates an acid by means of i-beam exposure, (c) a solvent and (d) a crosslinking agent, and wherein the total mass of the components (a), (b) and (d) relative to the total mass of the positive photosensitive resin composition excluding (c) the solvent is 88% by mass or more. |
| 申请公布号 |
WO2016051809(A1) |
申请公布日期 |
2016.04.07 |
| 申请号 |
WO2015JP05021 |
申请日期 |
2015.10.01 |
| 申请人 |
HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. |
发明人 |
MATSUKAWA, DAISAKU;ENOMOTO, TETSUYA;TANIMOTO, AKITOSHI;YOSHIZAWA, ATSUTARO |
| 分类号 |
G03F7/039;G03F7/004 |
主分类号 |
G03F7/039 |
| 代理机构 |
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代理人 |
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