POWER MODULE PACKAGE AND METHOD OF FABRICATING THEREOF

摘要

The present invention relates to a power module package comprising an upper sealing part and a lower heat radiation part. The rod of the lower heat radiation part is inserted in the upper sealing part having a penetration hole comprising the first penetration hole of the heat radiation substrate and the second penetration of a molding member. So, the upper sealing part is bonded to the lower heat radiation part. Heat generated in the upper sealing part can be quickly emitted. Also, the present invention includes a method of fabricating the power module package which can insert the rod of the lower heat radiation part into the penetration hole of the upper sealing part.