| 发明名称 |
METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP |
| 摘要 |
A method for manufacturing a semiconductor chip includes forming a front-side groove in a front surface of a substrate; forming a back-side groove wider than the front-side groove by a rotating cutting member from the back surface of the substrate toward the front-side groove; attaching a holding member having an adhesive layer to the back surface of the substrate after forming the back-side groove; dry-washing the back surface before attaching the holding member to the back surface; extending the distance between adjacent semiconductor chips by expanding the holding member attached to the back surface; and separating the semiconductor chips at the extended distance therebetween from the holding member. |
| 申请公布号 |
US2016099176(A1) |
申请公布日期 |
2016.04.07 |
| 申请号 |
US201514817873 |
申请日期 |
2015.08.04 |
| 申请人 |
FUJI XEROX CO., LTD. |
发明人 |
MATSUZAKI Hirokazu;YAMAZAKI Kenji;MURATA Michiaki;HASHIMOTO Takahiro;MINAMIRU Takeshi |
| 分类号 |
H01L21/78;H01L21/02;H01L21/683;H01L21/304 |
主分类号 |
H01L21/78 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for manufacturing a semiconductor chip comprising:
forming a front-side groove in a front surface of a substrate; forming a back-side groove wider than the front-side groove by a rotating cutting member from the back surface of the substrate toward the front-side groove; attaching a holding member having an adhesive layer to the back surface of the substrate after forming the back-side groove; dry-washing the back surface before attaching the holding member to the back surface; extending the distance between adjacent semiconductor chips by expanding the holding member attached to the back surface; and separating the semiconductor chips at the extended distance therebetween from the holding member. |
| 地址 |
Tokyo JP |
