| 摘要 |
Molding assemblies and methods for dual side package molding are described. In an embodiment, a molding compound is injected into a front cavity with a first actuator, and a molding compound is injected into a back cavity with a second actuator, with the first and second actuator assemblies being independently controlled. In an embodiment, the molding compound flows through a through-hole in a molding substrate from a front side of the molding substrate to a back side of the molding substrate, and into the back cavity. |
