CURABLE ORGANO POLYSILOXANE COMPOSITION, ENCAPSULANT, AND ELECTRONIC DEVICE

摘要

Provided is a curable organo polysiloxane composition comprising: (a) a compound represented by chemical formula 1 and having the number average molecular weight of less than 4,000; (b) a siloxane compound containing silicon bonded hydrogen (Si-H); and (c) a siloxane compound containing a silicon bonded alkenyl group (Si-Vi). Also provided are an encapsulant obtained by curing the composition and an electronic device comprising the encapsulant. In the chemical formula 1, each substituent is the same as defined in the present specification.