MANUFACTURING METHOD AND STRUCTURE OF CIRCUIT BOARD WITH VERY FINE CONDUCTIVE CIRCUIT LINES

摘要

A circuit board manufacturing method includes the steps of providing a conductive motherboard; forming a masking layer on the conductive motherboard, and the masking layer having a plurality of recessed portions that form a predetermined circuit pattern; forming a conductive electrode in each recessed portion, and the conductive electrodes together forming a conductive layer; providing a substrate having an adhesive layer provided thereon for sticking to a top of the masking layer and the conductive layer; and separating the substrate, the adhesive layer and the conductive layer from the conductive motherboard and the masking layer to provide a circuit board. The conductive motherboard is repeatedly usable and presents the predetermined circuit pattern through electroforming process, and the circuit pattern can be transferred to the substrate. The whole circuit board manufacturing process is simplified while ensures largely upgraded yield rate of very fine conductive circuit lines on the circuit board.

主权项

1. A manufacturing method of circuit board with very fine conductive circuit lines, comprising the following steps:
providing a conductive motherboard; forming a masking layer on the conductive motherboard, and the masking layer being provided with a plurality of recessed portions that form a predetermined circuit pattern; forming a conductive electrode in each of the recessed portions on the masking layer, and the conductive electrodes being very fine conductive circuit lines that together form a conductive layer; providing a substrate, on one side of which an adhesive layer is provided for sticking to a top of the masking layer and the conductive layer; and separating the substrate, the adhesive layer and the conductive layer from the masking layer and the conductive motherboard to provide a circuit board.