PRINTED WIRING BOARD WITH BUMP AND METHOD FOR MANUFACTURING THE SAME

摘要

A printed wiring board includes a base insulating layer including an insulating material, a conductor layer formed on the base insulating layer and including conductor pads, a coating insulating layer formed on the base insulating layer such that the coating insulating layer is covering the conductor layer and having opening portions exposing the conductor pads, respectively, and bumps formed on the conductor pads respectively such that each of the bumps includes an electroless plating metal layer formed on a respective one of the conductor pads and a solder layer formed on the electroless plating metal layer, the electroless plating metal layer having an upper end surface formed such that a central portion of the upper end surface is recessed relative to a peripheral portion of the upper end surface.

主权项

1. A printed wiring board, comprising:
a base insulating layer comprising an insulating material; a conductor layer formed on the base insulating layer and comprising a plurality of conductor pads; a coating insulating layer formed on the base insulating layer such that the coating insulating layer is covering the conductor layer and having a plurality of opening portions exposing the plurality of conductor pads, respectively; and a plurality of bumps formed on the plurality of conductor pads respectively such that each of the bumps comprises an electroless plating metal layer formed on a respective one of the conductor pads and a solder layer formed on the electroless plating metal layer, the electroless plating metal layer having an upper end surface formed such that a central portion of the upper end surface is recessed relative to a peripheral portion of the upper end surface.