发明名称 STRUCTURE FOR JOINING CERAMIC PLATE TO METAL CYLINDRICAL MEMBER
摘要 A member for semiconductor manufacturing device includes a susceptor 10 which is a ceramic plate formed of AlN and a gas introduction pipe 20 which is joined to the susceptor 10. An annular pipe joining bank 14 is provided at a position of the susceptor 10 facing a flange 22 of the gas introduction pipe 20. In addition, a pipe brazed part 24 is formed between the flange 22 and the pipe joining bank 14. The flange 22 has a width of 3 mm or more and a thickness of from 0.5 to 2 mm. It is preferable that the height of the pipe joining bank 14 be 0.5 mm or more, the edge of the bank facing the outer edge of the flange 22 be chamfered as designated by C0.3 or more or rounded as designated by R0.3 or more.
申请公布号 US2016099164(A1) 申请公布日期 2016.04.07
申请号 US201514964977 申请日期 2015.12.10
申请人 NGK INSULATORS, LTD. 发明人 KATAIGI Takashi;TANIMURA Takashi
分类号 H01L21/683;B23K1/00;B23K3/00;B23K1/19 主分类号 H01L21/683
代理机构 代理人
主权项 1. A structure for joining a ceramic plate to a metal cylindrical member, including: a flange which is formed at an end of the cylindrical member, an annular bank which is provided at a position of the ceramic plate facing the flange, and a brazed part which is formed in a space between the flange and the bank, wherein the flange has a width of 3 mm or more and a thickness of from 0.5 to 2 mm, an edge of the bank facing an outer edge of the flange is chamfered or rounded.
地址 Nagoya-City JP