| 摘要 |
[Problem] To provide a method for producing a laminate that enables micro wiring and the formation of a small-diameter via hole having excellent conduction reliability, and that includes a cured resin layer having high adhesiveness to a conductor layer and low surface roughness. [Solution] Provided is a laminate production method, characterized by comprising: a step for forming, upon a support, a curable resin composition layer comprising a curable resin composition so as to obtain a support-equipped curable resin composition layer; a step for laminating, to a substrate, the support-equipped curable resin composition layer on the curable resin composition layer formation side thereof so as to obtain a support-equipped pre-curing complex comprising the substrate and the support-equipped curable resin composition layer; a step for heating the complex and heat-curing the curable resin composition layer so as to achieve a cured resin layer and thus obtain a support-equipped cured complex comprising the substrate and the support-equipped cured resin layer; a step for opening a hole from the support side of the support-equipped cured complex so as to form a via hole in the cured resin layer; a step for removing residual resin within the via hole of the cured complex; a step for separating the support from the support-equipped cured complex so as to obtain a cured complex comprising the substrate and the cured resin layer; and a step for dry plating the cured resin layer and the inner wall surface of the via hole of the cured complex so as to form a dry plated conductor layer. |
