A method for depositing material is provided. The method includes sputtering material from a cathode array, wherein only one of two adjacent cathodes of the cathode array are operated to have one or more time intervals, wherein only one cathode of the adjacent cathodes sputter on the same substrate.
申请公布号
WO2016050284(A1)
申请公布日期
2016.04.07
申请号
WO2014EP70941
申请日期
2014.09.30
申请人
APPLIED MATERIALS, INC.;KLÖPPEL, ANDREAS;PIERALISI, FABIO;LIU, JIAN;HANIKA, MARKUS;LOPP, ANDREAS
发明人
KLÖPPEL, ANDREAS;PIERALISI, FABIO;LIU, JIAN;HANIKA, MARKUS;LOPP, ANDREAS
