Semiconductor Packages and Modules with Integrated Ferrite Material

摘要

A semiconductor package includes a lead frame having a die paddle and a plurality of leads including a gate lead spaced apart from the die paddle. The semiconductor package further includes a semiconductor die attached to the die paddle and having a plurality of pads including a gate pad, a plurality of electrical conductors connecting the pads to the leads, an encapsulant encasing the semiconductor die and a portion of the leads such that part of the leads are not covered by the encapsulant, and a ferrite material embedded in the encapsulant and surrounding a portion of the electrical conductor that connects the gate pad to the gate lead. A method of manufacturing the semiconductor package and a semiconductor module with integrated ferrite material are also provided.

主权项

1. A semiconductor package, comprising:
a lead frame comprising a die paddle and a plurality of leads including a gate lead spaced apart from the die paddle; a semiconductor die attached to the die paddle and having a plurality of pads including a gate pad; a plurality of electrical conductors connecting the pads to the leads; an encapsulant encasing the semiconductor die and a portion of the leads such that part of the leads are not covered by the encapsulant; and a ferrite material embedded in the encapsulant and surrounding a portion of the electrical conductor that connects the gate pad to the gate lead.