发明名称 INTEGRATED ELECTROSTATIC DISCHARGE (ESD) CLAMPING
摘要 A method of fabricating a laterally diffused metal-oxide-semiconductor (LDMOS) transistor device having a bipolar transistor for electrostatic discharge (ESD) protection includes doping a substrate to form a body region of the LDMOS transistor device in the substrate, the body region having a first conductivity type, forming a doped isolating region of the LDMOS transistor device in the substrate, the doped isolating region having a second conductivity type and surrounding a device area of the LDMOS transistor device in which the body region is disposed, forming a base contact region of the bipolar transistor, the base contact region being disposed within the body region and having the first conductivity type, and doping the substrate to form an isolation contact region for the doped isolating region that defines a collector region of the bipolar transistor, to form source and drain regions of the LDMOS transistor device in the substrate, and to form an emitter region of the bipolar transistor within the body region.
申请公布号 US2016099240(A1) 申请公布日期 2016.04.07
申请号 US201514966688 申请日期 2015.12.11
申请人 Chen Weize;Parris Patrice M. 发明人 Chen Weize;Parris Patrice M.
分类号 H01L27/02;H01L27/07;H01L21/768;H01L21/762;H01L29/66;H01L29/06 主分类号 H01L27/02
代理机构 代理人
主权项 1. A method of fabricating a laterally diffused metal-oxide-semiconductor (LDMOS) transistor device having a bipolar transistor for electrostatic discharge (ESD) protection, the method comprising: doping a substrate to form a body region of the LDMOS transistor device in the substrate, the body region having a first conductivity type; forming a doped isolating region of the LDMOS transistor device in the substrate to define a collector region of the bipolar transistor, the doped isolating region having a second conductivity type and surrounding a device area of the LDMOS transistor device in which the body region is disposed; forming a base contact region of the bipolar transistor, the base contact region being disposed within the body region and having the first conductivity type; and doping the substrate to form an isolation contact region for the doped isolating region, to form source and drain regions of the LDMOS transistor device in the substrate, and to form an emitter region of the bipolar transistor spaced from the source region within the body region.
地址 Phoenix AZ US
您可能感兴趣的专利