SEMICONDUCTOR PACKAGE AND CIRCUIT SUBSTRATE FOR THE SEMICONDUCTOR PACKAGE

摘要

Provided is a circuit substrate for a semiconductor package used for mounting a plurality of semiconductor devices. The circuit substrate including: a first circuit substrate unit; and a second circuit substrate unit that is formed on the first circuit substrate unit, wherein Young's modulus of a first dielectric material composing the dielectric layer of the first circuit substrate unit is higher than Young's modulus of a second dielectric material composing the dielectric layer of the second circuit substrate unit, and a coefficient of thermal expansion of the first dielectric material composing the dielectric layer of the first circuit substrate unit is smaller than a coefficient of thermal expansion of the second dielectric material composing the dielectric layer of the second circuit substrate unit.

主权项

1. A circuit substrate for a semiconductor package used for mounting a plurality of semiconductor devices, the circuit substrate comprising:
a first circuit substrate unit that has a stacked structure of a dielectric layer and a conductor layer; and a second circuit substrate unit that is formed on the first circuit substrate unit and has a stacked structure of a dielectric layer and a conductor layer, wherein Young's modulus of a first dielectric material composing the dielectric layer of the first circuit substrate unit is higher than Young's modulus of a second dielectric material composing the dielectric layer of the second circuit substrate unit, a coefficient of thermal expansion of the first dielectric material composing the dielectric layer of the first circuit substrate unit is smaller than a coefficient of thermal expansion of the second dielectric material composing the dielectric layer of the second circuit substrate unit, the first circuit substrate unit has an area of a circuit formation larger than that of the second circuit substrate unit, a plurality of electrodes used for mounting a semiconductor device are included on a surface of the second circuit substrate unit, and a minimum line width of an electrical line embedded in the second circuit substrate unit is smaller than a minimum line width of an electrical line embedded in the first circuit substrate unit.