CIRCUIT BOARD

摘要

A circuit board comprises: a heat transfer structure made of a highly thermal conductive material, wherein a part of the heat transfer structure, excluding an air cooling unit exposed to the outside of an insulation unit, is inserted into an insulation unit, and the air cooling unit may be configured to form a shape having a high specific surface area such as a wrinkled or an uneven shape. According to the present invention, a heat discharging problem is effectively handled, as reliability of the circuit board is secured, while heat dissipation performance is improved.