发明名称 |
COMPUTING DEVICE BONDING ASSEMBLIES |
摘要 |
The description relates to computing devices, such as mobile computing devices. One example can include a first portion, a second portion, and an adhesive. The example can also include micro heaters positioned proximate to the adhesive. The micro heaters are configured to be selectively energized to supply sufficient thermal energy to the adhesive to facilitate curing of the adhesive. |
申请公布号 |
WO2016053821(A1) |
申请公布日期 |
2016.04.07 |
申请号 |
WO2015US52541 |
申请日期 |
2015.09.28 |
申请人 |
MICROSOFT TECHNOLOGY LICENSING, LLC |
发明人 |
DIGHDE, RAJESH;SULLIVAN, TIM M. |
分类号 |
G06F1/16;B29C65/02;B29C65/48;C09J5/06;H05K5/06 |
主分类号 |
G06F1/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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