发明名称 |
LIGHT-EMITTING DIODE CHIP HAVING CURRENT DIFFUSION LAYER |
摘要 |
PROBLEM TO BE SOLVED: To provide a light-emitting diode chip having a current diffusion layer small in light absorption and unsusceptible to influence from moisture.SOLUTION: A light-emitting diode chip comprises a semiconductor laminate 5. The semiconductor laminate includes: a p-type semiconductor region 2; an n-type semiconductor region 4; and an active layer 3 disposed between the p-type semiconductor region 2 and the n-type semiconductor region 4, and serving to emit electromagnetic radiation. The n-type semiconductor region 4 is located on the side of a radiation outlet region 6 of the light-emitting diode chip, whereas the p-type semiconductor region 2 is located on the side of a carrier 7 of the light-emitting diode chip. The light-emitting diode chip further comprises a current diffusion layer 1 which is disposed between the carrier 7 and the p-type semiconductor region 2 and has a thickness of less than 500 nm. The current diffusion layer has one or more than one p-type-doped AlGaAs layer (0.5<x≤1) layer.SELECTED DRAWING: Figure 1 |
申请公布号 |
JP2016048785(A) |
申请公布日期 |
2016.04.07 |
申请号 |
JP20150206284 |
申请日期 |
2015.10.20 |
申请人 |
OSRAM OPTO SEMICONDUCTORS GMBH |
发明人 |
PETRUS SUNDGREN;ELMAR BAUR;MARTIN HOHENADLER;CLEMENS HOFMANN |
分类号 |
H01L33/14 |
主分类号 |
H01L33/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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