CONDUCTIVE POST AND MANUFACTURING METHOD OF MULTILAYER SUBSTRATE USING CONDUCTIVE POST

摘要

PROBLEM TO BE SOLVED: To provide a conductive post used in a method for manufacturing a multilayer substrate by electrically connecting two substrates, with which excessive solder wetting toward a conductive post can be suppressed in a more simple manner.SOLUTION: A conductive post used to electrically connect a first substrate and a second substrate includes: a columnar conductive element assembly; an insulation film covering a side peripheral surface of the conductive element assembly; and a solder film covering the upper end surface and the lower end surface of the conductive element assembly. The conductive post has a columnar shape and has an aspect ratio (height/maximum diameter) between a height in a longitudinal direction and the maximum diameter in a transverse direction within a range of 1.5-5.0.SELECTED DRAWING: Figure 3