发明名称 パワーモジュール用基板の製造方法
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a substrate for a power module capable of joining a ceramic substrate and a metal layer in a short time.SOLUTION: A laminate 30 formed by laminating a ceramic substrate 2 and metal layers 6, 7 by interposing a bonding material between them, and a cushion sheet 40 having a carbon layer 42 formed on both surfaces of a graphite layer 41 are laminated with each other and heated in a state where an increase in the height of these laminates is restricted, thereby manufacturing a substrate for a power module by joining the ceramic substrate 2 and the metal layers 6, 7.
申请公布号 JP5900559(B2) 申请公布日期 2016.04.06
申请号 JP20140174211 申请日期 2014.08.28
申请人 三菱マテリアル株式会社 发明人 青木 慎介;長瀬 敏之
分类号 H01L23/36;H01L23/12 主分类号 H01L23/36
代理机构 代理人
主权项
地址