发明名称 リードフレームおよびリードフレームの製造方法
摘要 <P>PROBLEM TO BE SOLVED: To provide a lead frame in which deformation of a connecting bar can be prevented while suppressing occurence of bur during the sewing, and to provide a method of manufacturing the same. <P>SOLUTION: A lead frame 10 comprises a plurality of lead frame elements 14 including a die pad 15, and a plurality of leads 16 provided around the die pad 15. Between adjoining lead frame elements 14, a pair of corresponding leads 16 are connected via a connecting bar 17. The connecting bar 17 extends perpendicularly to the longitudinal direction of the leads 16, and has a plurality of lead connecting portions 18 located between the pair of corresponding leads 16, and a plurality of reinforcing portions 19 located between the lead connecting portions 18. The reinforcing portion 19 of the connecting bar 17 has a trapezoidal cross section of the same thickness as that of the leads 16. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP5899614(B2) 申请公布日期 2016.04.06
申请号 JP20100263871 申请日期 2010.11.26
申请人 大日本印刷株式会社 发明人 冨 田 幸 治;張 替 洋 二;矢 崎 雅 樹
分类号 H01L23/50 主分类号 H01L23/50
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