发明名称 |
A PROCESS FOR THE MANUFACTURE OF SEMICONDUCTOR DEVICES COMPRISING THE CHEMICAL MECHANICAL POLISHING (CMP) OF III-V MATERIAL IN THE PRESENCE OF A CMP COMPOSITION COMPRISING A SPECIFIC NON-IONIC SURFACTANT |
摘要 |
A process for the manufacture of semiconductor devices comprising the chemical-mechanical polishing of a substrate or layer containing at least one III-V material in the presence of a chemical-mechanical polishing composition (Q1) comprising (A) inorganic particles, organic particles, or a mixture or composite thereof, (B) at least one amphiphilic non-ionic surfactant having (b1) at least one hydrophobic group; and (b2) at least one hydrophilic group selected from the group consisting of polyoxyalkylene groups comprising (b22) oxyalkylene monomer units other than oxyethylene monomer units; and (M) an aqueous medium. |
申请公布号 |
EP2852644(A4) |
申请公布日期 |
2016.04.06 |
申请号 |
EP20130794728 |
申请日期 |
2013.05.21 |
申请人 |
BASF SE |
发明人 |
NOLLER, BASTIAN MARTEN;GILLOT, CHRISTOPHE;FRANZ, DIANA;LI, YUZHUO |
分类号 |
H01L21/306;C09G1/02 |
主分类号 |
H01L21/306 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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